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Grinder S Gnx200

Back grinder for 200mm GNX200 Technology Prize from the Japan Society of Mechanical Engineers in 1996 Own developed Downfeed Grinding Index wafer transfer mechanism targeting wafer breakage ZERO, high accuracy, high efficiency come true on 200mm wafer. New Type Sgepifications Unit

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  • 40-Year Qualified Brand

    Founded in the 1970s, it has a history of more than 40 years.

  • 350,000 Ping Workshop

    covering an area of 350,000 square meters

  • 160 Countries

    production and sales in more than 160 countries

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